STVM is Home to the Grand Prize Winner at the BEST Medicine Science Fair
Date Posted: March 17, 2017
STVM Sophomore Max Chmura took top honors at the BEST Medicine Science Fair held at NIHF Middle School in Akron on March 11, 2017.The Bridging Engineering, Science and Technology (BEST) Medicine engineering fair, Northeast Ohio’s premier engineering fair, is devoted exclusively to students interested in exploring biomedical engineering, bringing together the most talented and innovative students to interact with each other and with leaders in medical device research and development.
The fair is hosted by The University of Akron. Max won the grand prize which is an all expenses paid trip for two to Los Angeles, California to compete at the 2017 Intel International Science and Engineering Fair as well as 1st place in the value-driven engineering category.
St. Vincent-St. Mary High School had 9 other students compete at the fair: Michael Chmura, Joe Conti, Kevin Feezel, Vincent Glidden, Molly Haines, Zichao “Chao” Hu, Meijin “May” Li, Alex Oliverio and Caroline Pier. Joseph Conti won 1st place- Medical Devices and The University of Akron Scholarship Award, Kevin Feezel won 2nd place- Modeling/ Simulation/ Medical IT and Alex Oliverio won the Cleveland Clinic Award.
Congratulations to all of the students who participated in the fair. You hard work and dedication to science is very inspirational! Good luck Max at the 2017 Intel International Science Fair!